Package of finger print sensor and fabricating method thereof

摘要

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

主权项

1. A semiconductor device comprising:
a semiconductor die comprising a first surface, a second surface opposite the first surface, and side surfaces connecting the first and second surfaces, where the first surface comprises an image sensor and a plurality of bond pads; a first passivation layer covering the first surface of the semiconductor die and comprising openings that expose the bond pads; first redistribution layers (RDLs) electrically connected to the bond pads exposed through the first passivation layer; an encapsulation layer surrounding at least the side surfaces of the semiconductor die; a plurality of vias electrically connected to the first RDLs at a first end of the vias and passing through the encapsulation layer; second RDLs electrically connected to a second end of the vias and at least partially formed over the encapsulation layer; a second passivation layer exposing first portions of the second RDLs and covering second portions of the second RDLs and the encapsulation layer; and electrical connection structures coupled to the exposed first portions of the second RDLs.