| 发明名称 | Buffer layer for sintering | ||
| 摘要 | A layer of material having a low thermal conductivity is coated over a substrate. A film of conductive ink is then coated over the layer of material having the low thermal conductivity, and then sintered. The film of conductive ink does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide. | ||
| 申请公布号 | US9131610(B2) | 申请公布日期 | 2015.09.08 |
| 申请号 | US201314073986 | 申请日期 | 2013.11.07 |
| 申请人 | PEN Inc.;Ishihara Chemical Co., Ltd. | 发明人 | Yaniv Zvi;Yang Mohshi;Laxton Peter B. |
| 分类号 | H01L23/48;H05K1/09;B22F3/105;B22F7/04;B23K26/34;H01L21/268;H01L21/48;H05K3/46;H01L21/288;H01L23/532;H05K1/02;H05K3/10;B23K26/32;B23K35/02;H01L21/768;H05K3/12 | 主分类号 | H01L23/48 |
| 代理机构 | Matheson Keys & Kordzik PLLC | 代理人 | Kordzik Kelly;Matheson Keys & Kordzik PLLC |
| 主权项 | 1. A method comprising: coating a layer of material having a low thermal conductivity over a substrate; depositing a film of conductive ink over the layer of material having the low thermal conductivity; and sintering the film of conductive ink. | ||
| 地址 | Deerfield Beach FL US | ||