Electronic module and method for manufacturing electronic module

摘要

The Electronic Module has a body case 2, including a plurality of case members 3, 4 and that has an internal space (S) where a first opening P1 is formed on one side surface of the internal space and a second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space of the body case, and a resin body 6 that covers the substrate 5 by being filled in the internal space of the body case and solidified or hardened, and is characterized by that a plurality of the case members and the substrate 5 are integrated by the use of the resin body 6 as an accouplement.

主权项

1. An Electronic Module comprising
a body case that comprises a plurality of case members by making an abutting contact each other and that has an internal space where a first opening is formed on one side surface of the internal space and a second opening that opens in a direction different from that of the first opening is in an exposed state when a plurality of the case members are separated each other, a substrate on which an electronic component is mounted and that is housed in the internal space of the body case, and a resin body that covers the substrate by being filled into the internal space of the body case and being solidified or hardened, and characterized by that the plurality of case members and the substrate are integrated by the use of the resin body as an accouplement, wherein the plurality of case members include a first case member and a second case member, wherein an internal surface of the first case member comprises: a first set of guide parts for receiving the substrate; and a second set of guide parts for receiving the second case member, the first case member holding the substrate and the second case member parallel with each other.