| 发明名称 | Light-emitting device manufacturing method | ||
| 摘要 | A method for manufacturing a light-emitting device comprises retaining a conductor wire so that a straight-line distance between adjacent mounting portions while the conductor is retained is less than a distance along the conductor wire between the adjacent mounting portions; mounting a plurality of light emitting diodes to respective ones of the mounting portions on the retained conductor wire; and after the mounting step, sealing the plurality of light-emitting diodes mounted on the conductor wire. | ||
| 申请公布号 | US9130138(B2) | 申请公布日期 | 2015.09.08 |
| 申请号 | US201313954878 | 申请日期 | 2013.07.30 |
| 申请人 | NICHIA CORPORATION | 发明人 | Marutani Yukitoshi;Miyata Tadaaki |
| 分类号 | H01L25/075;H01L33/62;H01L27/15;F21K99/00;H01L33/52 | 主分类号 | H01L25/075 |
| 代理机构 | Foley & Lardner LLP | 代理人 | Foley & Lardner LLP |
| 主权项 | 1. A method for manufacturing a light-emitting device, the method comprising: retaining a conductor wire so that a straight-line distance between adjacent mounting portions while the conductor is retained is less than a distance along the conductor wire between the adjacent mounting portions; mounting a plurality of light emitting diodes to respective ones of the mounting portions on the retained conductor wire; and releasing the retention of the conductor wire on which the plurality of light-emitting diodes are mounted, wherein a straight-line distance between the adjacent mounting portions after the retention is released is less than or equal to the distance along the conductor wire between the adjacent mounting portions and greater than the straight-line distance between adjacent mounting portions while the conductor is retained. | ||
| 地址 | Anan-shi JP | ||