Semiconductor package and method of forming

摘要

The semiconductor package includes: a package substrate comprising a bonding pad; a plurality of semiconductor chips stacked on the package substrate; and a bonding wire configured to electrically connect the semiconductor chips and the bonding pad. For at least one of the plurality of semiconductor chips: the semiconductor chip comprises: a semiconductor device; a first pad electrically connected to the semiconductor device; a conductive pattern; and a second pad electrically connected to the first pad, spaced apart from the conductive pattern, and extending over the conductive pattern; and the bonding wire is connected to the second pad.

主权项

1. A semiconductor package comprising:
a package substrate comprising a bonding pad; a plurality of semiconductor chips stacked on the package substrate; and a bonding wire configured to electrically connect the semiconductor chips and the bonding pad; wherein for each semiconductor chip of at least one of the plurality of semiconductor chips, the semiconductor chip comprises:
a semiconductor device;a first pad electrically connected to the semiconductor device;a conductive pattern; anda second pad electrically connected to the first pad, spaced apart from the conductive pattern, extending over the conductive pattern, and connected to the bonding wire.