发明名称 Heat dissipating method for light emitting diode and lighting device using same
摘要 A heat dissipating method for a light emitting diode is provided. The heat dissipating method includes following steps. Firstly, a circuit board with a light emitting diode formed on one side and a heat dissipating fan formed on the other side is provided. The heat dissipating fan is configured to dissipate heat for the light emitting diode. Secondly, a power source is provided for supplying power for the light emitting diode. Finally, a speed of the heat dissipating fan is adjusted according to an input power of the power source. A lighting device using the heat dissipating method is also provided.
申请公布号 US9131559(B2) 申请公布日期 2015.09.08
申请号 US201313892316 申请日期 2013.05.13
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 Lai Chih-Chen
分类号 H05B33/00;H05B33/08 主分类号 H05B33/00
代理机构 Novak Druce Connolly Bove + Quigg LLP 代理人 Novak Druce Connolly Bove + Quigg LLP
主权项 1. A heat dissipating method for a light emitting diode, comprising following steps: providing a circuit board with a light emitting diode formed on one side of the circuit board and a heat dissipating fan formed on the other side of the circuit board, the heat dissipating fan being configured to dissipate heat for the light emitting diode; providing a power source for supplying power for the light emitting diode; adjusting a speed of the heat dissipating fan according to an input power P of the power source; and providing a voltmeter and a galvanometer, the voltmeter being parallel-connected with the power source to determine an input voltage V of the power source, the galvanometer being connected between the power source and the light emitting diode in series to determine an input current I of the power source, the input power P of the power source is calculated as following expression: P=V*I.
地址 New Taipei TW