Method of forming a thin substrate chip scale package device and structure

摘要

In one embodiment, a method for forming an electronic package structure includes providing a single unit leadframe having first terminals on a first or top surface. An electronic device is attached to the single unit leadframe and electrically connected to the first terminals. The leadframe, first terminals, and the electronic device are encapsulated with an encapsulating material. Second terminals are then formed by removing portions of a second or bottom surface of the leadframe. In one embodiment, the method can be used to fabricate a thin substrate chip scale package (“tsCSP”) type structure.

主权项

1. A method for forming an electronic package structure comprising:
providing a single unit leadframe having first terminals protruding in a first predetermined array on a first surface, the first terminals separated by a plurality of grooves; placing an adhesive within a first groove, wherein the adhesive is absent from a second groove; attaching an electronic chip to the first surface with the adhesive, wherein the electronic chip overlaps the first groove; forming an encapsulating layer on the first surface to encapsulate the electronic chip, wherein the encapsulating layer is within the second groove; and removing portions of a second surface of the single unit leadframe to form second terminals in a second predetermined array on the second surface and coupled to the first terminals, wherein the first predetermined array is different than the second predetermined array.