Semiconductor module

摘要

A semiconductor module includes an insulating substrate (200) that is made of AlN and that has a first plane (201) and a second plane (202) both of which face mutually opposite directions, a first conductor layer (210) formed on the first plane (201), a second conductor layer (220) formed on the second plane (202), a semiconductor device (300) bonded to the first conductor layer (210) with a first solder layer (510) interposed therebetween, and a heat dissipation plate (400) that is formed in a rectangular shape when viewed planarly and that is bonded to the second conductor layer (220) with a second solder layer (520) interposed therebetween, and, in this semiconductor module, the heat dissipation plate (400) is deformed so as to become convex in a direction in which the second plane (202) is pointed when viewed from a width direction thereof.

主权项

1. A semiconductor module comprising:
an insulating substrate that is made of AlN and that has a first plane and a second plane both of which face mutually opposite directions; a first conductor layer formed on the first plane; a second conductor layer formed on the second plane; a semiconductor device bonded to the first conductor layer with a first solder layer interposed therebetween; and a heat dissipation plate that is formed in a rectangular shape when viewed planarly and that is bonded to the second conductor layer with a second solder layer interposed therebetween; the heat dissipation plate being deformed so as to become convex in a direction in which the second plane is pointed when viewed from a width direction of the heat dissipation plate, wherein a distance in a thickness direction of a surface on a same side as a lengthwise center and lengthwise both ends of the heat dissipation plate is greater than 0 μm and is 100 μm or less.