发明名称 OLED display with spalled semiconductor driving circuitry and other integrated functions
摘要 Spalling is employed to generate a single crystalline semiconductor layer. Complementary metal oxide semiconductor (CMOS) logic and memory devices are formed on a single crystalline semiconductor substrate prior to spalling. Organic light emitting diode (OLED) driving circuitry, solar cells, sensors, batteries and the like can be formed prior to, or after, spalling. The spalled single crystalline semiconductor layer can be transferred to a substrate. OLED displays can be formed into the spalled single crystalline semiconductor layer to achieve a structure including an OLED display with semiconductor driving circuitry and other functions integrated on the single crystalline semiconductor layer.
申请公布号 US9129924(B2) 申请公布日期 2015.09.08
申请号 US201314041853 申请日期 2013.09.30
申请人 International Business Machines Corporation 发明人 Li Ning;Sadana Devendra K.
分类号 H01L27/00;H01L27/32;H01L33/00 主分类号 H01L27/00
代理机构 Scully, Scott, Murphy & Presser, P.C. 代理人 Scully, Scott, Murphy & Presser, P.C. ;Percello, Esq. Louis J.
主权项 1. A method for forming a structure including an OLED display with semiconductor driving circuitry and other functions, said method comprising: providing a single crystalline semiconductor substrate having at least logic and memory devices formed on an exposed surface of the single crystalline semiconductor substrate; forming a surface protection layer on the exposed surface of the single crystalline semiconductor substrate having the at least logic and memory devices formed thereon; forming a stressor layer above the surface protection layer, wherein said stressor layer has a thickness and a tensile stress value that causes spalling mode fracture to occur within the single crystalline semiconductor substrate upon spalling; spalling the single crystalline semiconductor substrate to provide a spalled single crystalline semiconductor layer having the at least logic and memory devices located on a surface thereof, wherein said spalling is performed spontaneously without using any manual means to initiate crack formation and propagation; forming a substrate on a surface of the spalled single crystalline semiconductor layer opposite the surface having the at least logic and memory devices located thereon; and forming an organic light emitting diode (OLED) display on the spalled single crystalline semiconductor layer and adjacent the at least logic and memory devices.
地址 Armonk NY US