| 发明名称 | Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device | ||
| 摘要 | A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant. | ||
| 申请公布号 | US9129898(B2) | 申请公布日期 | 2015.09.08 |
| 申请号 | US201313933230 | 申请日期 | 2013.07.02 |
| 申请人 | Hitachi Chemical Company, Ltd. | 发明人 | Honda Kazutaka;Enomoto Tetsuya;Nakamura Yuuki |
| 分类号 | H01L23/29;H01L21/56;C09J163/00 | 主分类号 | H01L23/29 |
| 代理机构 | Griffin & Szipl, P.C. | 代理人 | Griffin & Szipl, P.C. |
| 主权项 | 1. A semiconductor device comprising: (1) at least one semiconductor chip; (2) a board, wherein the at least one semiconductor chip is connected to the board; and (3) a semiconductor encapsulation adhesive composition that-comprising (a) an epoxy resin,(b) a curing agent,(c) an antioxidant, wherein the antioxidant is a hindered phenol, and(d) a high molecular component with a weight-average molecular weight of 10,000 or greater wherein gaps between the semiconductor chips and the board are underfilled with the semiconductor encapsulation adhesive composition. | ||
| 地址 | Tokyo JP | ||