摘要 |
PROBLEM TO BE SOLVED: To provide an LED illumination device capable of reducing the manufacturing cost.SOLUTION: The LED illumination device comprises: a heat sink 5 having a main face 51a and a back face 51b and provided with a through hole 53a between the main face 51a and back face 51b; a plurality of LED substrates 6 provided on the main face 51a side; and a first LED lighting device 71 provided on the back face 51b side. The plurality of LED substrates 6 are arranged and spaced in an X axis direction and adjacent LED substrates 6 are connected through wiring 11 to form a first LED illumination circuit 10. First wiring 71a, which connects the anode side of the first LED lighting device 71 to the first LED illumination circuit 10, and second wiring 71b, which connects the cathode side of the first LED lighting device 71 to the first LED illumination circuit 10, are drawn from the back face 51b side through the through hole 53a to the main face 51a side, and connected respectively to the LED substrates 6 neighboring the through hole 53a among the plurality of LED substrates 6. |