| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent damage of a device formed on the surface, and to stick a protective tape well to the back side of a wafer.SOLUTION: A sticking method of a protective tape is a method of sticking a protective tape (14) to the back side (11) of a water (W) having a surface (10) where a MEMS device (12) is formed. It is configured so that a wafer is mounted on the adhesive layer (16) of a protective tape, while directing the back side of the wafer downward, and then the wafer is suction held, while being heated on the holding surface (23) of a suction table (2) via the protective tape.</p> |
