| 摘要 |
PROBLEM TO BE SOLVED: To provide: a resin composition for sealing an electronic device which never causes air to be trapped between a base material and itself in sealing, enables the suppression of percolation of water vapor; and an electronic device sealed by use of such a resin composition for sealing an electronic device.SOLUTION: A resin composition comprises (A) a polybutadiene polymer expressed by the chemical formula (1) below, and having at least one (meth)acryloyl group at a terminal and (B) a photoinitiator, but it does not comprise a thermoplastic resin having a mass-average molecular weight of 50,000 or larger. (In the formula, R1 and R2 represent a hydroxyl group or (meth)acroyloxy group; R3 and R4 represent a bivalent organic group having 1-16 carbon atoms, but no nitrogen; R5, R6 and R7 represent a hydrogen atom or an alkyl group having 1-10 carbon atoms; "l" and "m" are 0 or 1; and "n" are each an integer of 15-150.) |
