| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a projection is provided on a back surface of a semiconductor chip, solder joint is performed and thereby solder thickness can be secured.SOLUTION: A semiconductor device of the present invention is provided with a projection of a bump on a back surface electrode of a semiconductor chip, in a constitution where the semiconductor chip is joined to a support plate. For example, the semiconductor chip is a SiC diode, the projection is an aluminum bump, the support plate is a lead frame, and solder is used as a joining material for joining the semiconductor chip and the support plate.</p> |
