| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device and a bonding method which can reduce processing time per one circuit board and inhibit an increase in space.SOLUTION: A bonding device comprises: an intermediate stage 41; a transfer part 30 for transferring a semiconductor chip 11 to place the semiconductor chip 11 on the intermediate stage 41; and a first bonding part 50A and a second bonding part 50B for picking up the semiconductor chip 11 from the intermediate stage 41 to bond the semiconductor chip 11 to a circuit board 15. The intermediate stage 41 moves between a first position P1 where the first bonding part 50A can pick up the semiconductor chip 11 and a second position P2 where the second bonding part 50B can pick up the semiconductor chip 11. |
