ULTRASONIC DEVICE UNIT, PROBE, ELECTRONIC DEVICE AND ULTRASONIC IMAGE APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an ultrasonic device unit which can sufficiently attenuate an ultrasonic wave on a back side of a vibration membrane even if the thickness of a substrate is reduced. ! SOLUTION: An ultrasonic device unit DV comprises: a first substrate 44 which has an element array including a plurality of thin film type ultrasonic transducer elements arranged in the array shape on a first surface and an opening 46 opening on a second surface opposite to the first surface for each of the thin film type ultrasonic transducer elements; and a second substrate 53 which is connected to the second surface of the first substrate 44. The second substrate 53 comprises a through hole having the stretch receiving at least the contour of the element array in a planar view from the thickness direction of the first substrate 44 and continuing from the opening 46. ! COPYRIGHT: (C)2015,JPO&INPIT