发明名称 |
THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF OPERATING THE SAME |
摘要 |
<p>A thermocompression bonding system for bonding semiconductor elements is provided. The thermocompression bonding system includes (1) a bond head assembly including a heater for heating an semiconductor element to be bonded, the bond head assembly including a fluid path configured to receive a cooling fluid; (2) a pressurized cooling fluid source; (3) a booster pump for receiving a pressurized cooling fluid from the pressurized cooling fluid source, and for increasing a pressure of the received pressurized cooling fluid; (4) a pressurized fluid reservoir for receiving pressurized cooling fluid from the booster pump; and (5) a control valve for controlling a supply of pressurized cooling fluid from the pressurized fluid reservoir to the fluid path.</p> |
申请公布号 |
KR20150102739(A) |
申请公布日期 |
2015.09.07 |
申请号 |
KR20150028423 |
申请日期 |
2015.02.27 |
申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
WASSERMAN MATTHEW B. |
分类号 |
H01L23/00;H01L21/02;H01L21/447;H01L23/34 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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