| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an organic semiconductor element which minimizes function deterioration caused by bonding defects and interfacial peeling.SOLUTION: An organic semiconductor element 10 has a composition in which a first electrode layer 14, an organic semiconductor layer 16, a second electrode layer 18, a flexible support medium layer 20 and a hardening layer 22, each composed of a hardened material of a hardenable composition, are laminated on a substrate 12 in this order. A manufacturing method of the organic semiconductor element comprises the steps of: bonding a first bonding member which uses the substrate 12 as a base material and includes at least the first electrode layer 14 on one surface and a second bonding member which uses the flexible support medium layer 20 as a base material and includes at least the second electrode layer 18 on one surface of the flexible support medium layer 20 so as to face the one surface side of the first bonding member with the one surface side of the flexible support medium layer 20; and hardening a hardenable composition layer which is arranged on the other surface of the flexible support medium layer 20 and composed of a hardenable composition containing hardenable resin in the bonding process or after the bonding process.</p> |
