发明名称 HEAT TREATMENT CONTAINER, HEAT TREATMENT CONTAINER ASSEMBLY, AND SEMICONDUCTOR ELEMENT MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a compact heating container which allows for efficient heat treatment of a SiC substrate.SOLUTION: A heat treatment container is a container for heat treating a SiC substrate 40, at least the surface of which is composed of single crystal SiC, under Si vapor pressure, and includes a container 30 and a substrate support 50. The container 30 has an internal space 33 for achieving the Si vapor pressure, and a part of the internal space 33 is opened. The substrate support 50 can support the SiC substrate 40, and by supporting the SiC substrate 40, the open part of the container 30 is covered and the internal space 33 becomes a sealed space.
申请公布号 JP2015162655(A) 申请公布日期 2015.09.07
申请号 JP20140038715 申请日期 2014.02.28
申请人 TOYO TANSO KK 发明人 TORIMI SATOSHI;YABUKI NORITO;NOGAMI AKIRA
分类号 H01L21/302;C30B29/36;C30B33/08;H01L21/265;H01L21/324 主分类号 H01L21/302
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