| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can release generated heat while inhibiting an increase in mounting area.SOLUTION: A semiconductor device comprises: s support medium which has a thickness almost the same with that of a bare chip and is arranged adjacent to the bare chip; a flexible circuit board on which the bare chip and the support medium are mounted and which is folded so as to surround the bare chip and the support medium; a heat release part which is provided by thermal contact with an external surface of the flexible circuit board which surrounds the bare chip and the support medium; and leg parts which pierce the flexible circuit board to conduct heat in a region surrounded by the flexible circuit board to the outside of the region surrounded by the flexible circuit board. |
