EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention relates to an embedded board and a manufacturing method thereof. The embedded board according to the embodiment of the present invention includes an insulation layer of an outer layer, an electronic element which is arranged on the insulation layer of the outer layer, a circuit layer of the outer layer which protrudes from one side of the insulation layer of the outer layer, a first via which is formed on the insulation layer of the outer layer and electrically connects the electronic element to the circuit layer of the outer layer, and a buildup layer which is formed on the other side of the insulation layer of the outer layer and includes a buildup insulation layer and a buildup circuit layer.