| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device of pasting a protective tape to a wafer so as to efficiently seal the peripheral end of the wafer, and to provide a method of manufacturing a wafer to which a protective tape is pasted.SOLUTION: A device of pasting a protective tape to a wafer includes a protective tape pasting section (d) for pasting a protective tape A, having an external diameter larger than that of a wafer W, to the rear surface of the wafer W so as to project from the peripheral end of the wafer W, and an end sealing section (i) for pasting a protective tape B, having an external diameter larger than that of the wafer W, to the surface of the wafer W to which the protective tape A is pasted in the protective tape A pasting section, so as to project from the peripheral end of the wafer W, integrating the peripheral end of the protective tape A and the peripheral end of the protective tape B, and sealing the peripheral end of the wafer W.</p> |
