| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate evaluation device which performs correction of a physical quantity based on the amount of warp at a place in a substrate where the physical quantity is measured.SOLUTION: A substrate evaluation device includes: an amount of warp detector 4 for detecting the amount of warp of a substrate 100 by measuring the distance from the measurement surface of the substrate 100; a physical quantity measuring section 5 provided separately from the measurement surface of the substrate 100, and for performing noncontact measurement of a predetermined physical quantity of the substrate 100, the measurement value of which changes depending on the amount of warp of the substrate 100; a substrate movement mechanism 6 for moving the substrate between the warp detector 4 and physical quantity measuring section 5; and a control section 20 for controlling the substrate movement mechanism 6 so that a place in the substrate 100 where the amount of warp is detected, and a place in the substrate 100 where the physical quantity is measured are overlapped.</p> |
