CONTACT BUMP CONNECTION AND CONTACT BUMP AND METHOD FOR PRODUCING A CONTACT BUMP CONNECTION

摘要

The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component provided with at least one terminal face (11) and a contact substrate (26) contacted with the component and having at least one second terminal face (25) wherein the first terminal face is provided with a contact bump (10) which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) which is surrounded by the raised edge and is open towards a head end of the contact bump and in a contact region (31) with the first terminal face the second terminal face has a contact bead (30) which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and surrounds the displacement pin wherein said contact bead has a bead crown (33) which is directed to a base (17) of the displacement compartment and is raised relative to a level contact surface (32) of the second terminal face surrounding the contact region.