| 摘要 |
<p>The invention presents a switching device having a substrate, a power semiconductor component, a connecting device, load connection devices and a pressure device. In this case, the substrate has electrically insulated conductor tracks and a power semiconductor component is arranged on a conductor track. The connecting device is formed as a film composite having an electrically conductive film and an electrically insulating film, and has a first and a second main surface. The switching device is connected in an internally circuit-conforming manner by the said connecting device. The pressure device has a pressure body with a first recess, a pressure element being arranged such that it projects out of the said recess, wherein the pressure element presses onto a section of the second main surface of the film composite and, in this case, the said section is arranged within the surface of the power semiconductor component in projection along the normal direction of the power semiconductor component.</p> |
