发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE PACKAGE |
摘要 |
<p>The present invention relates to a semiconductor package, wherein a capacitor is formed in a partial region of multiple conductive connection members such as a solder ball or the like which electrically connect a lower package and an upper package, thereby enabling smoother power supply to a semiconductor chip die within the package and simplifying a manufacturing process.</p> |
申请公布号 |
KR20150101737(A) |
申请公布日期 |
2015.09.04 |
申请号 |
KR20140023382 |
申请日期 |
2014.02.27 |
申请人 |
AMKOR TECHNOLOGY KOREA, INC. |
发明人 |
KIM, KYOUNG ROCK;KIM, BYONG JIN;CHOI, HO |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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