COLLET FOR BODING SEMICONDUCTOR DIE

摘要

The present invention relates to a collet for bonding a semiconductor die. For an example, the collet includes: a collet holder which has vacuum holes penetrating upper and lower sides; and a collet plate which is combined to the lower part of the collect holder, connects the vacuum holes and an absorption hole into one, and has a cavity vacuum part which is formed in the opposite surface of the vacuum holes to be connected to the absorption hole.