| 摘要 |
<p>The present invention relates to a device for cutting a hard material using ultrasonic waves, comprising: a cutting tool which has an ultrasonic wave generator to cut a hard material with a diamond abrasive using the ultrasonic waves from the ultrasonic wave generator and is mainly made of stainless steel; an abrasive injector to apply an abrasive including fine diamond particles onto the hard material to cut the hard material; and a cutting tool driving device for applying a force to the cutting tool in a vertical direction to cut the hard material. Therefore, the device for cutting a hard material using ultrasonic waves is applicable for processing hard materials such as sapphire and reinforced glass applied to a smartphone and the like.</p> |
