PREPARATION METHOD OF REUSE TA TARGETS FOR SEMICONDUCTORS AND THE TA SPUTTERING TARGET PREPARED THEREBY

摘要

The present invention relates to a new manufacturing method to reuse a tantalum waste target consumed with sputter action by an ion, and a reused tantalum sputtering target manufactured by the method. According to the present invention, an existing tantalum waste target is reused to improve economic feasibility by reducing costs and shortening a processing time.