ENCAPSULATION MATERIAL FOR OPTICAL MODULE, METHOD FOR MANUFACTURING SAME, AND OPTICAL MODULE

摘要

The present application relates to an encapsulation material for an optical module, a method for manufacturing same, and an optical module. The encapsulation material, according to the present application, has improved creep properties by having excellent heat resistance, thus is subject to less deformation and can show excellent adhesive force even when used for a long time in high-temperature and/or highly humid conditions, thereby improving durability when applied in an optical module.