| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD |
| 摘要 |
A printed circuit board includes a substrate and a plurality of pad forming regions disposed thereon. The plurality of pad forming regions are spaced apart from each other by a predetermined distance. A plurality of connection pads are disposed on a portion of the plurality of pad forming regions. The plurality of connection pads are configured to transmit or receive a signal to an external device or from the external device. The printed circuit board includes a path configured for the transportation of moisture therein. |
| 申请公布号 |
US2015250057(A1) |
申请公布日期 |
2015.09.03 |
| 申请号 |
US201414525830 |
申请日期 |
2014.10.28 |
| 申请人 |
SAMSUNG DISPLAY CO., LTD. |
发明人 |
KU Jung-Hoon;KOO Yong-Woo;KIM Ki-Yong |
| 分类号 |
H05K1/11;H05K7/02;H05K1/02 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board, comprising;
a substrate having a plurality of pad forming regions disposed thereon, wherein the pad forming regions of the plurality of pad forming regions are spaced apart from each other by a predetermined distance; a plurality of connection pads disposed on a portion of the plurality of pad forming regions, wherein the plurality of connection pads is configured to transmit or receive a signal to an external device or from the external device; and a path configured for the transportation of moisture therein. |
| 地址 |
YONGIN-CITY KR |
