发明名称 FORMATION METHOD OF CONDUCTOR LAYER
摘要 PROBLEM TO BE SOLVED: To provide a formation method of a conductor layer excellent in initial peel strength of the conductor layer, and capable of suppressing decline of peel strength after being placed under a high temperature or a high humidity condition. ! SOLUTION: In a formation method of a conductor layer, a surface provided with a polyimide layer (a) of a polyimide film provided with the polyimide layer (a) on one surface or on both surfaces of a polyimide layer (b) is subjected to a polyimide etching treatment to thereby remove at least a part of the polyimide layer (a), and the conductor layer is formed on the surface. In the formation method of the conductor layer, the etching treatment time is set in a prescribed time range. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015157480(A) 申请公布日期 2015.09.03
申请号 JP20150010076 申请日期 2015.01.22
申请人 UBE IND LTD 发明人 MIURA TORU ; BANBA KEITA ; KODA MASAFUMI ; YOKOZAWA YOSHIHIRO
分类号 B32B27/34;B32B15/088;C08G73/10;H05K1/03;H05K3/18;H05K3/38 主分类号 B32B27/34
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