| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of avoiding poor connection caused by warpage of an electronic component and a connection structure. ! SOLUTION: A wiring board 20 includes: a thick plate part 21a; and a thin plate part 21b, supported by the thick plate part 21a, thinner than the thick plate part 21a, having flexibility. A columnar electrode 22 is disposed at the thin plate part 21b. A first electronic component is disposed at one surface side of the wiring board 20 and, at the other surface side, a second electronic component 17 is disposed. The first electronic component 15 and the second electronic component 17 are electrically coupled through the electrode 22. ! COPYRIGHT: (C)2015,JPO&INPIT |
