| 发明名称 |
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND METHOD FOR MODIFYING SURFACE OF INSULATING LAYER |
| 摘要 |
A wiring substrate includes an insulating layer and a pad exposed from the insulating layer. An outermost surface of the insulating layer is modified to have a hydrophobic property by being stamped with silicone. |
| 申请公布号 |
US2015250051(A1) |
申请公布日期 |
2015.09.03 |
| 申请号 |
US201514627099 |
申请日期 |
2015.02.20 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
YUMOTO Hideki;HARAYAMA Yoichi |
| 分类号 |
H05K1/03;H05K1/11 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring substrate comprising:
an insulating layer; and a pad exposed from the insulating layer; wherein an outermost surface of the insulating layer is modified to have a hydrophobic property by being stamped with silicone. |
| 地址 |
Nagano JP |
