发明名称 HIGH-TEMPERATURE SUPERCONDUCTING WIRE MATERIAL
摘要 A high-temperature superconducting wire material comprising: a pre-superconducting wire material layer formed by forcibly removing a metal substrate from a superconducting wire material formed by including the metal substrate, a buffer layer formed on the upper surface of the metal substrate and a superconducting conductive layer formed on the upper surface of the buffer layer; a silver (Ag) protective layer formed on the lower surface of the pre-superconducting wire material layer; and a copper (Cu) protective layer formed on the lower surface of the Ag protective layer. Since a superconducting wire material is formed by stripping a metal substrate of a second-generation high-temperature superconducting wire material and forming a metal protective layer, advantages include the reduction of a magnetization loss due to the magnetism of the substrate, excellent stability of the wire material, and increases in Je (engineering current density) due to the minimization of the thickness of the superconducting wire material.
申请公布号 US2015248952(A1) 申请公布日期 2015.09.03
申请号 US201514713233 申请日期 2015.05.15
申请人 KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE 发明人 Ko Rock-kil;Sohn Myung-hwan;Jo Young-sik;Ha Dong-woo;Kang Boo-min;Kim Dong-hyuk
分类号 H01B12/06;H01L39/24;H01B13/00;H01L39/12 主分类号 H01B12/06
代理机构 代理人
主权项 1. A high-temperature superconducting wire material, comprising: a pre-superconducting wire material layer formed by forcibly removing a metal substrate from a superconducting wire material comprising the metal substrate, a buffer layer formed on an upper surface of the metal substrate, and a superconducting layer formed on an upper surface of the buffer layer; a silver (Ag) protective layer formed on a lower surface of the pre-superconducting wire material layer; and a copper (Cu) protective layer formed on a lower surface of the Ag protective layer.
地址 Changwon-si KR