| 摘要 |
An electronic apparatus includes first and second electronic devices (10,12), and first and second heat sinks (14,16) for dissipating heat, wherein there is each of electrical conductivity between the first electronic device (10) which may be an electrical power amplifier and the first heat sink (14), thermal conductivity between the first electronic device and the first heat sink, electrical conductivity between the second electronic device (12) which may be a laser diode and the second heat sink (16), and thermal conductivity between the second electronic device and the second heat sink, wherein electrical conductivity is provided between the first and second heat sinks (14,16) with an electrical bridge (22) which may be a thin copper stripe like used for PCB. A thermal resistance is provided between the first and second heat sinks (14,16) by for example a gap (20), so that the second heat sink (16) of the laser diode (12) remains cooler than the first heat (14) of its electrical driver (10), such as for protecting the second electrical device from the heat generated by the first electronic device. The heat sinks may have fins (17) for improving heat transfer to the environment. |
