INHIBITOR PLASMA MEDIATED ATOMIC LAYER DEPOSITION FOR SEAMLESS FEATURE FILL

摘要

Systems and methods for depositing a film in a substrate processing system include: a step of performing a first atomic layer deposition (ALD) cycle in a processing chamber to deposit a film on a substrate including a feature; a step of exposing the substrate to inhibitor plasma in the processing chamber for a predetermined period to create a varying passivated surface in the feature after the first ALD cycle; and a step of performing a second ALD cycle in the processing chamber to deposit the film on the substrate after the predetermined period.