| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-wiring board which has high mounting reliability and in which a signal line between a plurality of electronic components is formed in the high density.SOLUTION: A printed-wiring board comprises a first pad 58GP and a wiring structure 20. The wiring structure 20 comprises a second conductor layer 38, a second insulating layer laminated on the second conductor layer, and a third conductor layer 48 including a third pad 48P formed on the second insulating layer 40. The upper surface of the first pad 58GP and the upper surface of the third pad 48P are located on the same plane. For this reason, the printed-wiring board has high connection reliability with the IC chip mounted on the first pad and the third pad. |
