| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor chip or wafer with an anisotropic conductive film which allows for inspection of a connecting portion before being connected, and prediction of the number of conductive particles contributive to the connection, while ensuring recognition of an alignment mark during the connection.SOLUTION: A method of manufacturing a semiconductor chip with an anisotropic conductive film includes a step for filling the circuit electrode surface of a semiconductor chip, having a plurality of circuit electrodes on one surface, with an insulating adhesive, a step for forming a conductive particle layer on a support, a step for laminating the conductive particle layer on a semiconductor chip with an insulating adhesive layer, thus obtained, and a step for peeling the semiconductor chip with an insulating adhesive layer from the support. The step for forming the conductive particle layer on the support is represented by a step for forming the conductive particle layer, on the support where conductive particles are arranged in one layer while being dispersed substantially planarly, in an insulating resin, by stretching a conductive particle filling sheet biaxially. |
