发明名称 |
EPITAXIAL SILICON CARBIDE WAFER MANUFACTURING METHOD |
摘要 |
The present invention provides a manufacturing method by which it is possible to obtain, when manufacturing an epitaxial SiC wafer by epitaxial growth of SiC on an SiC substrate, an epitaxial SiC wafer having a high-quality epitaxial film with even less comets and lamination defects than in the past. This epitaxial silicon carbide wafer manufacturing method is characterized in that the pre-growth atmosphere gas that flows into a growth furnace prior to the start of epitaxial growth contains hydrogen gas, with the remainder being an inactive gas and unavoidable impurities, and the hydrogen gas content is 0.1-10.0 vol% with respect to the inactive gas. |
申请公布号 |
WO2015129867(A1) |
申请公布日期 |
2015.09.03 |
申请号 |
WO2015JP55893 |
申请日期 |
2015.02.27 |
申请人 |
NIPPON STEEL & SUMITOMO METAL CORPORATION |
发明人 |
AIGO, TAKASHI;ITO, WATARU;FUJIMOTO, TATSUO |
分类号 |
C30B29/36;C30B25/02 |
主分类号 |
C30B29/36 |
代理机构 |
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代理人 |
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