| 发明名称 |
METHOD OF FORMING PACKAGE ASSEMBLY |
| 摘要 |
A method of forming a package assembly includes forming a no-flow underfill layer on a substrate. The method further includes attaching a semiconductor die to the substrate. The semiconductor die comprises a bump and a molding compound layer in physical contact with a lower portion of the bump. An upper portion of the bump is in physical contact with the no-flow underfill layer. |
| 申请公布号 |
US2015249066(A1) |
申请公布日期 |
2015.09.03 |
| 申请号 |
US201514713476 |
申请日期 |
2015.05.15 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIN Hung-Jen;WANG Tsung-Ding;LEE Chien-Hsiun;LU Wen-Hsiung;CHENG Ming-Da;LIU Chung-Shi |
| 分类号 |
H01L23/00;H01L21/768;H01L21/56 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a package assembly, the method comprising:
forming a no-flow underfill layer on a substrate; and attaching a semiconductor die to the substrate, wherein the semiconductor die comprises a bump and a molding compound layer in physical contact with a lower portion of the bump; and wherein an upper portion of the bump is in physical contact with the no-flow underfill layer. |
| 地址 |
Hsinchu TW |
