发明名称 FLUX AND SOLDER PASTE
摘要 A soldering flux of the present invention contains, as a base resin, an acrylic resin (A) having an acid value of 0 to 70, and an acrylic resin (B) having an acid value of 30 to 230. The acrylic resin (A) is obtained by polymerization of a monomer mixture containing alkyl (meth)acrylate having an alkyl group having carbon atoms of 12 to 23. The acrylic resin (B) is obtained by polymerization of a monomer mixture containing alkyl (meth)acrylate having an alkyl group having carbon atoms of 6 to 10. The acid value of the acrylic resin (B) is higher than the acid value of the acrylic resin (A), and a difference between these two resins is 15 or more.
申请公布号 KR20150101460(A) 申请公布日期 2015.09.03
申请号 KR20157020167 申请日期 2013.12.13
申请人 HARIMA CHEMICALS, INC. 发明人 INOUE KOSUKE;SHIGESADA TETSUYUKI;TAKESHIMA KENICHI;SUKEKAWA TAKUJI;MURATA MASAO
分类号 B23K35/36;B23K35/26;B23K35/362;C22C13/00;H05K3/34 主分类号 B23K35/36
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