发明名称 WIRING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board excellent in accuracy of a relative position between a first terminal part and a second terminal part, and a manufacturing method of the wiring circuit board.SOLUTION: A suspension substrate 1 with circuit comprises: a base insulation layer 5; a first conductor layer 31 including power supply wiring 23 provided on the base insulation layer 5; an intermediate insulation layer 6 provided on the base insulation layer 5 so as to coat the power supply wiring 23; and a second conductor layer 32 including external wiring 26 provided on the intermediate insulation layer 6. The second conductor layer 32 comprises: an element side terminal 22 for electrically connecting the power supply wiring 23 to a light-emitting element 3; a head side terminal 25 for electrically connecting the external wiring 26 to a slider 2; and a connection end 28 for electrically connecting the element side terminal 22 to the power supply wiring 23.
申请公布号 JP2015158963(A) 申请公布日期 2015.09.03
申请号 JP20140034484 申请日期 2014.02.25
申请人 NITTO DENKO CORP 发明人 TANABE HIROYUKI
分类号 G11B5/60;G11B21/21 主分类号 G11B5/60
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