| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a strong LED light source module having an effect for enhancing the beam intensity by increasing the emission efficiency.SOLUTION: A whole LED wafer is prepared by plating the surface of an LED wafer, where an electrode of large size is not located, with a thin film 21 of high refractive index. The LED wafer plated with a thin film 21 of high refractive index is divided, as required, into an LED wafer monomer 2. The LED wafer monomer 2 is fixed to the substrate 1 surface, the substrate 1 comes into contact with one surface plated with a thin film 21 of high refractive index, and the LED wafer monomer 2 is connected by means of a bonding wire 4. Five remainder surfaces of the LED wafer monomer 2 are also plated with a thin film 21 of high refractive index. A fully equipped LED light source module is assembled or package, as required. |
