发明名称 |
SEMICONDUCTOR PROCESS |
摘要 |
A semiconductor process of the present invention is described as follows. A substrate is provided, and a material layer is deposited on the substrate using an organic precursor as a reactant gas. A plasma treatment is conducted immediately after depositing the material layer, wherein plasma is continuously supplied during depositing the material layer and the plasma treatment. A pump-down step is conducted. |
申请公布号 |
US2015249008(A1) |
申请公布日期 |
2015.09.03 |
申请号 |
US201514712925 |
申请日期 |
2015.05.15 |
申请人 |
UNITED MICROELECTRONICS CORPORATION |
发明人 |
WANG CHIH-CHUN;CHEN CHUN-FENG |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A semiconductor process, comprising the following steps in the sequence set forth:
providing a substrate in a chamber; introducing an organic precursor and a reactant gas into the chamber; depositing a material layer on the substrate in a presence of plasma; turning off the organic precursor and continuing to supply the plasma during a plasma treatment after the material layer is formed; and conducting a pump-down step. |
地址 |
HSINCHU TW |