发明名称 SEMICONDUCTOR PROCESS
摘要 A semiconductor process of the present invention is described as follows. A substrate is provided, and a material layer is deposited on the substrate using an organic precursor as a reactant gas. A plasma treatment is conducted immediately after depositing the material layer, wherein plasma is continuously supplied during depositing the material layer and the plasma treatment. A pump-down step is conducted.
申请公布号 US2015249008(A1) 申请公布日期 2015.09.03
申请号 US201514712925 申请日期 2015.05.15
申请人 UNITED MICROELECTRONICS CORPORATION 发明人 WANG CHIH-CHUN;CHEN CHUN-FENG
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项 1. A semiconductor process, comprising the following steps in the sequence set forth: providing a substrate in a chamber; introducing an organic precursor and a reactant gas into the chamber; depositing a material layer on the substrate in a presence of plasma; turning off the organic precursor and continuing to supply the plasma during a plasma treatment after the material layer is formed; and conducting a pump-down step.
地址 HSINCHU TW