| 摘要 |
<p>The present invention discloses a holder for a module substrate and a method for manufacturing an electronic component of a mobile device using the same. The holder for a module substrate according to an embodiment of the present invention has: rectangular lattice holes which accommodate a plurality of module substrates; a holder frame which is formed for the edges thereof to be integrated with the gaps between the lattice holes, and a back side adhesive member which is prepared on the back side of the holder frame, provides a fixing surface for fixing a location of the module substrates on the upper side of the holder frame by penetrating the lattice holes, and is made of a material capable of preventing thermal deformation of the material itself and the damage to the material itself when modules are surface-mounted on the upper part of the module substrates whose locations are fixed.</p> |
