发明名称 GRINDING DEVICE
摘要 PROBLEM TO BE SOLVED: To grind platy work to be required thickness, by precisely measuring the thickness of the platy work under grinding.SOLUTION: In a grinding device 10 for grinding platy work formed by at least two layers of first work and second work, a first thickness calculating portion 531 calculates the thickness of the first work from the optical path length difference of lights reflected on an upper surface and a lower surface of the first work, and a second thickness calculating portion 532 calculates the thickness of the second work from the optical path length difference of lights reflected on an upper surface and a lower surface of the second work. A temperature calculating portion 533 calculate the temperature of the second work on the basis of the thickness calculated by the second thickness calculating portion 532. A thickness correcting portion 534 calculates a refractive rate of the first work on the basis of the temperature calculated by the temperature calculating portion 533, and corrects the thickness calculated by the first thickness calculating portion 531 on the basis of the calculated refractive rate. By grinding the platy work while measuring and correcting the thickness of the platy work, the platy work is ground to be a required thickness.
申请公布号 JP2015157331(A) 申请公布日期 2015.09.03
申请号 JP20140032669 申请日期 2014.02.24
申请人 DISCO ABRASIVE SYST LTD 发明人 YOSHIDA SHINJI
分类号 B24B37/34;B24B37/015;B24B49/12;B24B49/14;H01L21/304;H01L21/66 主分类号 B24B37/34
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