发明名称 ELECTRONIC DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic device manufacturing method which can keep high reliability of an oscillator and form a cavity for storing the oscillator in a small size and with high accuracy. ! SOLUTION: An electronic device manufacturing method comprises: a process of forming a first semiconductor layer on a substrate 10 and patterning the first semiconductor layer to form a bottom electrode 22 of an oscillator 20; a process of forming a first layer on a surface of the bottom electrode; a process of forming a second semiconductor layer on the substrate and bottom electrode, and patterning the second semiconductor layer to form an upper electrode 24 of the oscillator; a process of etching the first layer to form the bottom electrode and the upper electrode to be arranged at a distance from each other; a process of forming a second layer on the bottom electrode and upper electrode; a process of forming in the second layer, a side wall which surrounds the oscillator in a planar view; a proc
申请公布号 JP2015159455(A) 申请公布日期 2015.09.03
申请号 JP20140033779 申请日期 2014.02.25
申请人 SEIKO EPSON CORP 发明人 YOSHIZAWA TAKAHIKO
分类号 H03H3/007;B81C1/00;H03H9/24 主分类号 H03H3/007
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