| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer protection film that prevents damage to a wafer and causes no contamination of the wafer. ! SOLUTION: A wafer protection film 1 is formed by the lamination of an inner layer comprising synthetic resin and surface layers formed on its both faces, wherein the surface layers comprise polyethylene polymerized by a metallocene catalyst and carbon black. ! COPYRIGHT: (C)2015,JPO&INPIT |
