| 摘要 |
<p>The present invention relates to a light emitting device package, a backlight unit, a lighting device, and a manufacturing method of the light emitting device package, the light emitting device packing comprising: a light emitting device which is provided in a flip-chip form having a first pad and a second pad; a lead frame which is provided with a first electrode having at least one first accommodation cup portion in one direction with respect to an electrode separation space, a second electrode having at least one second accommodation cup potion in the other direction with reference to the electrode separation space, and in which the light emitting device is placed; a first bonding medium which is installed between the first pad and the first electrode such that the first pad of the light emitting device is electrically connected to the first electrode of the lead frame; a second bonding medium which is installed between the second pad and the second electrode such that the second pad of the light emitting device is electrically connected to the second electrode of the lead frame, wherein the first bonding medium is an internal bonding layer which is primarily supplied in a flow state into the first accommodation cup portion, primarily reflows, and is hardened and an external bonding layer which is secondarily supplied in a flow state to the internal bonding layer to extend from the internal bonding layer to the outside of the first accommodation cup portion, secondarily reflows after the light emitting device is placed, and is hardened.</p> |
